CuO Nanofluid Effect On Cooling Performance Considering Thermal Resistance CFD Simulation, Numerical Paper Validation
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€360.00 Original price was: €360.00.€185.00Current price is: €185.00.
A suspension of copper oxide nanoparticles in a base fluid, CuO nanofluid, could enhance cooling performance in engineering applications. Nanoparticles change the base fluid’s thermal features, improving heat transfer. Researchers can use simulations to study cooling system fluid dynamics and thermal behavior to determine the best design parameters for heat transfer efficiency. Simulation allows for cost-effective scenario exploration and nanofluid behavior prediction in real-world applications, enabling the development of more efficient and sustainable cooling solutions.
Given the importance of simulation of cooling performance under the usage of nanoparticles, a Numerical Paper Validation study is conducted to study CuO nanofluid effect on cooling performance according to “Numerical study on the effect of CuO-water nanofluid on cooling 5 performance of two different cross-sectional heat sinks” paper. As given in Figure 6a of the paper, thermal resistance is reported in different Reynolds numbers. In our case, the volume fraction of nanoparticles is 0.5%.
Simulation Process
The channel with a rectangular cross-section is designed using Design Modeler software. Then, it has meshed in ANSYS Meshing using a structured grid demonstrated below:
Consequently, 112800 cells are generated.
In microchannels, the flow regime almost always remains laminar. As said before, the volume fraction of CuO nanoparticles is 0.5%, so based on the relations, the thermal properties of the mixture of water and nanoparticles must be calculated. Also, an expression should be written in the software to report thermal resistance. The copper walls of the microchannel can effectively transfer heat that is applied to its walls.
Post-processing
Despite the importance of temperature and velocity contours in understanding the heat transfer mechanism, we aim to monitor thermal resistance and compare it to the paper results. The paper reports thermal resistance as 0.082 when Reynolds is 350. Our simulation results show a value of 0.081, which is incredibly close. The simulation results are completely in agreement with the paper.
Reference Paper | Present CFD Simulation | Error | |
Thermal Resistance | 0.082 | 0.081 | 1.2% |
We pride ourselves on presenting unique products at CFDLAND. We stand out for our scientific rigor and validity. Our products are not based on guesswork or theoretical assumptions like many others. Instead, most of our products are validated using experimental or numerical data from valued scientific journals. Even if direct validation isn’t possible, we build our models and assumptions on the latest research, typically using reference articles to approximate reality.
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